Small form factor and low profile quad-band System-in-Package (SiP) module

Author

Shevelov, Mykola ; Sieroshtan, Volodymyr ; Ruban, Oleksandr ; Burygin, Andriy ; Komakha, Petro ; Aleksieiev, Oleg ; Chayka, Oleg ; Sevskiy, Georgiy ; Stoehr, Peter ; Heide, Patrie ; Vossiek, Martin

Author_Institution

Product Dev. Modules, EPCOS AG (TDK-EPC), Munich, Germany

fYear

2011

fDate

5-10 June 2011

Firstpage

1

Lastpage

4

Abstract

A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art brand new 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for dual band WLAN and GPS, number of SMD components and metal case which provides mechanical protection and implements EMI shielding. A laminate substrate provides the interconnection and distribution of the signals and ground to various components and acts as the carrier to support the die and allow the die IOs to be distributed to the package IOs. Very compact SiP solution with dimensions of 9.5×11.9×1.2mm³ forms a complete stand-alone multi functional wireless communication system.

Keywords

CMOS integrated circuits; electromagnetic interference; electromagnetic shielding; system-in-package; ΓM radio; ΓM transmitter; 2.4G WLAN; 5G WLAN; Bluetooth; CMOS IC; EMI shielding; GPS; RF front-end module; SMD components; dual band WLAN; laminate substrate; low profile quad-band SiP module; low profile quad-band system-in-package module; mechanical protection; metal case; multifunctional wireless communication system; signal distribution; signal interconnection; size 65 nm; CMOS integrated circuits; Electromagnetics; Frequency modulation; Indexes; OFDM; Radio frequency; Surface acoustic waves; FM; electromagnetic shielding; global positioning system (GPS); laminate substrate; system-in-package (SiP); wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International

Conference_Location

Baltimore, MD

ISSN

0149-645X

Print_ISBN

978-1-61284-754-2

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2011.5972704

Filename

5972704