Title :
30th Annual Electrical Overstress/ Electrostatic Discharge Symposium
Abstract :
The following topics were dealt with: electrostatic discharge; on-chip ESD failure; numerical simulation; reliability; ESD qualification test methods; on-chip protection; bipolar technology; smartpower technology; RF circuit; high-voltage applications; sub-class 0 devices; MR-heads; MEMS; advanced CMOS analog technology; advanced CMOS digital technology; ESD protection targets; high speed circuits; high frequency circuits; automated ESD rule verification; EDA tools; electrical overstress failure; failure analysis; automated equipment; system level stress; TCAD; CDM testing; and ESD control and design.
Keywords :
CMOS analogue integrated circuits; CMOS digital integrated circuits; bipolar integrated circuits; electrostatic discharge; failure analysis; magnetic heads; micromechanical devices; numerical analysis; power integrated circuits; radiofrequency integrated circuits; reliability; CDM testing; EDA tools; ESD control; ESD design; ESD protection targets; ESD qualification test methods; MEMS; MR-heads; RF circuit; TCAD; advanced CMOS analog technology; advanced CMOS digital technology; automated ESD rule verification; automated equipment; bipolar technology; electrical overstress failure; electrostatic discharge; failure analysis; high frequency circuits; high speed circuits; high-voltage applications; numerical simulation; on-chip ESD failure; on-chip protection; reliability; smartpower technology; sub-class 0 devices; system level stress;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-146-4
Electronic_ISBN :
978-1-58537-147-1
