Title :
Hermetic packaging for power multichip modules
Author :
Schulz-Harder, Jürgen ; Meyer, Andreas
Author_Institution :
ELECTRO VAC CURAMIK GMBH, Regensburg
Abstract :
Hermetic packaging is a requirement for all applications where electronic components must be protected from corrosive environments to ensure acceptable service life. Extremely high reliability is required for space and military electronics, often utilizing hermetic packages. Metal packages with glass to metal seals are the common solution for low to medium power levels. For high power applications, high current has to be carried and high heat losses to be dissipated. Due to poor thermal conductivity and limited electric conductivity of metals used in standard hermetic packages, direct bond copper solutions have been developed.
Keywords :
multichip modules; power electronics; thermal conductivity; corrosive environments; direct bond copper; electric conductivity; electronic components; hermetic packaging; high power applications; metal packages; power multichip modules; thermal conductivity; Bonding; Electronic components; Electronic packaging thermal management; Electronics packaging; Glass; Multichip modules; Protection; Seals; Standards development; Thermal conductivity; Aerospace; Cooling; Industrial application; Packaging; Thermal design;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417533
