DocumentCode
2583618
Title
Design and analysis of self-repairable MEMS accelerometer
Author
Xiong, Xingguo ; Wu, Yu-Liang ; Jone, Wen-Ben
Author_Institution
Dept. of ECECS, Cincinnati Univ., OH, USA
fYear
2005
fDate
3-5 Oct. 2005
Firstpage
21
Lastpage
29
Abstract
In this paper, a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. If any of the working module in the main device is found faulty, the control circuit will replace it with a good redundant module. In this way, the faulty device can be self-repaired through redundancy. The sensitivity loss due to device modularization can be well compensated by different design alternatives. The yield model for MEMS redundancy repair is developed. The simulation results show that the BISR (built-in self-repair) design leads to effective yield increase compared to nonBISR design, especially for a moderate nonBISR yield. By implementing the fault tolerance feature into MEMS devices, the yield as well as the reliability of a MEMS device implemented in a SoC can be improved.
Keywords
accelerometers; built-in self test; electron device manufacture; fault tolerance; microsensors; redundancy; system-on-chip; MEMS redundancy repair; MEMS reliability; SoC system; built-in self-repair design; device modularization; fault tolerance; microaccelerometer; self-repairable MEMS accelerometer; yield analysis; yield model; Accelerometers; Aerospace materials; Built-in self-test; Circuit faults; Fault tolerance; Fault tolerant systems; Manufacturing processes; Microelectromechanical devices; Micromechanical devices; Redundancy;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 2005. DFT 2005. 20th IEEE International Symposium on
ISSN
1550-5774
Print_ISBN
0-7695-2464-8
Type
conf
DOI
10.1109/DFTVS.2005.30
Filename
1544500
Link To Document