Reliability testing of semiconductor devices in a humid environment

The influence of the humidity on semiconductor device reliability is investigated in order to emphasize the role of the humidity in the failure process as a stress factor and to model the reliability-humidity relationship. Experiments were performed on two types of plastic-encapsulated semiconductor devices (optoelectronic and ICs). Reliability data obtained from functioning at humidity and temperature are compared with those obtained from functioning at the same temperatures, but at a lower humidity level. The role of the humidity as a stress factor is made obvious by identifying the specific failure mechanisms induced. The experimental data are used for the validation of an original model, a generalized Arrhenius relation. The model allows the design of accelerated tests with humidity as one of the stress factors. A comparison of the model with previous models is given