Title :
Thermal-aware test scheduling and hot spot temperature minimization for core-based systems
Author :
Liu, Chunsheng ; Veeraraghavan, Kugesh ; Iyengar, Vikram
Author_Institution :
Comput. & Electron. Eng., Nebraska-Lincoln Univ., Omaha, NE, USA
Abstract :
Chip overheating has become a critical problem during test of today´s complex core-based systems. In this paper, we address the overheating problem by incorporating thermal constraints in the test scheduling of core-based systems. We propose two algorithms for which the objective is to spread heat more evenly over the chip and reduce hot spots. The first uses the layout information to guide test scheduling, while the second relies on a progressive weighting mechanism. Experimental results show that the proposed thermal-constrained methods can not only guarantee a thermal-safe test schedule, but also reduce hot spot temperatures, leading to a balanced thermal distribution across the chip during test.
Keywords :
integrated circuit testing; microprocessor chips; scheduling; system-on-chip; temperature distribution; balanced thermal distribution; chip overheating; complex core-based systems; hot spot temperature minimization; hot spot temperature reduction; progressive weighting mechanism; thermal constraints; thermal-aware test scheduling; thermal-safe test schedule; Circuit testing; Electronic equipment testing; Microelectronics; Minimization; Power dissipation; Processor scheduling; Rivers; System testing; Temperature; Thermal management;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems, 2005. DFT 2005. 20th IEEE International Symposium on
Print_ISBN :
0-7695-2464-8
DOI :
10.1109/DFTVS.2005.66