• DocumentCode
    2584562
  • Title

    Thermal-aware test scheduling and hot spot temperature minimization for core-based systems

  • Author

    Liu, Chunsheng ; Veeraraghavan, Kugesh ; Iyengar, Vikram

  • Author_Institution
    Comput. & Electron. Eng., Nebraska-Lincoln Univ., Omaha, NE, USA
  • fYear
    2005
  • fDate
    3-5 Oct. 2005
  • Firstpage
    552
  • Lastpage
    560
  • Abstract
    Chip overheating has become a critical problem during test of today´s complex core-based systems. In this paper, we address the overheating problem by incorporating thermal constraints in the test scheduling of core-based systems. We propose two algorithms for which the objective is to spread heat more evenly over the chip and reduce hot spots. The first uses the layout information to guide test scheduling, while the second relies on a progressive weighting mechanism. Experimental results show that the proposed thermal-constrained methods can not only guarantee a thermal-safe test schedule, but also reduce hot spot temperatures, leading to a balanced thermal distribution across the chip during test.
  • Keywords
    integrated circuit testing; microprocessor chips; scheduling; system-on-chip; temperature distribution; balanced thermal distribution; chip overheating; complex core-based systems; hot spot temperature minimization; hot spot temperature reduction; progressive weighting mechanism; thermal constraints; thermal-aware test scheduling; thermal-safe test schedule; Circuit testing; Electronic equipment testing; Microelectronics; Minimization; Power dissipation; Processor scheduling; Rivers; System testing; Temperature; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Defect and Fault Tolerance in VLSI Systems, 2005. DFT 2005. 20th IEEE International Symposium on
  • ISSN
    1550-5774
  • Print_ISBN
    0-7695-2464-8
  • Type

    conf

  • DOI
    10.1109/DFTVS.2005.66
  • Filename
    1544555