DocumentCode
2584757
Title
Experimental analysis of temperature distribution within traction IGBT modules
Author
Perpiñà, X. ; Garonne, O. ; Rochet, J.-P. ; Jalby, P. ; Mermet-Guyennet, M. ; Rebollo, J.
Author_Institution
PEARL, Semeac
fYear
2007
fDate
2-5 Sept. 2007
Firstpage
1
Lastpage
10
Abstract
This work establishes a method which allows a rapid thermal evaluation of both IGBT modules and cooling systems during an acceleration or deceleration cycle experienced along any traction application. Usually, the followed methodologies to test the cooling systems in railway applications are based on power pulses which rapidly reach its steady-state, instead of using current saw-tooth waveforms more similar to the real working environment. This procedure has been applied to a heat pipe-based thermosyphon optimised for railway applications. From the experiment results, it is concluded that the temperature distribution inside the power module is strongly dependent on both the thermal excitation procedure applied to the whole system and the way to mechanically fix the power modules to the cooling system.
Keywords
insulated gate bipolar transistors; power transistors; temperature distribution; traction power supplies; acceleration cycle; cooling systems; heat pipe-based thermosyphon; saw-tooth waveforms; temperature distribution; thermal design; traction IGBT modules; traction power supplies; Cooling; Electronic packaging thermal management; Insulated gate bipolar transistors; Inverters; Multichip modules; Power system reliability; Rail transportation; Temperature distribution; Thermal resistance; Thermal stresses; Mission profile; Traction application; measurement; power semiconductor device; termal stress; thermal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2007 European Conference on
Conference_Location
Aalborg
Print_ISBN
978-92-75815-10-8
Electronic_ISBN
978-92-75815-10-8
Type
conf
DOI
10.1109/EPE.2007.4417613
Filename
4417613
Link To Document