DocumentCode
2584854
Title
Molecular Dynamics Simulation for the diffusion of water in amorphous polymers examined at different Temperatures
Author
Dermitzaki, E. ; Bauer, J. ; Walter, Hans ; Wunderle, B. ; Michel, Bruno ; Reichl, Herbert
Author_Institution
Dept. Mech. Reliability & Micro Mater., Fraunhofer Inst. of Reliability & Microintegration, Berlin
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
9
Abstract
The authors first investigate a polymeric composite material ( epoxy resin with silicone nanoparticles) and determine its mechanical properties (coefficient of thermal expansion-CTE and Young´s Modulus-E) by a combined experimental and simulative (homogenisation) approach. The size distribution and the volume fraction percentage of the nanoparticles were determined as well as the variation of the mechanical properties of the pure epoxy resin compared to the composite material especially synthesized for this investigation. Then the diffusion coefficient of water in amorphous polymeric materials is measured (aromatic epoxy: 1,3-Bis-(2,3- epoxypropyl)-benzene and amine hardener: 1,2- Diaminoethan). Mechanical characterization of the materials, diffusion experiments (gravimetric), and molecular dynamics (MD) simulations examine the temperature range of 300-400 K, where diffusion coefficients will be calculated under thermodynamic boundary conditions by using a classical force-field MD. The diffusion mechanisms and the mechanical characterization are examined as a function of the stoichiometry and molecular weight of the polymers.
Keywords
Young´s modulus; amorphous state; diffusion; filled polymers; molecular dynamics method; nanocomposites; nanoparticles; thermal expansion; water; 1,2-Diaminoethan; 1,3-Bis-(2,3- epoxypropyl)-benzene; H2O; Young´s Modulus; amorphous polymers; classical force-field MD; diffusion coefficient; epoxy resin; mechanical properties; molecular dynamics simulation; polymeric composite material; silicone nanoparticles; temperature 300 K to 400 K; thermal expansion; water; Amorphous materials; Composite materials; Epoxy resins; Mechanical factors; Nanocomposites; Nanoparticles; Polymers; Temperature distribution; Thermal expansion; Thermodynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.359925
Filename
4201122
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