Experimental characterization methods for power MOSFET assemblies

Author

Wernicke, Thies ; Dieckerhoff, Sibylle ; Kirfe, Tino ; Feix, Gudrun ; Guttowski, Stephan ; Reichl, Herbert

Author_Institution

Tech. Univ. of Berlin, Berlin

fYear

2007

fDate

2-5 Sept. 2007

Firstpage

1

Lastpage

9

Abstract

In this paper, experimental methods to characterize the electrical and thermal package properties of newly developed MOSFET technology demonstrators are discussed. The electrical measurements focus on the switching characteristics and the stray inductance. From the thermal point of view, the steady-state temperature distribution within the package is measured. Exemplarily, measurement results for the FlipChip on Flex technology applying low-voltage, high current MOSFETs are used for the evaluation.

Keywords

assembling; flip-chip devices; power MOSFET; semiconductor device measurement; temperature distribution; thermal management (packaging); Flex technology; FlipChip; electrical measurements; power MOSFET assembly; steady-state temperature distribution; stray inductance; switching characteristics; thermal package property; Assembly; Bonding; Electronic packaging thermal management; Flip chip; MOSFET circuits; Power MOSFET; Semiconductor device measurement; Semiconductor device packaging; Semiconductor diodes; Wire; Emerging Technology; MOSFET; Measurement; Packaging; Test Bench;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2007 European Conference on

Conference_Location

Aalborg

Print_ISBN

978-92-75815-10-8

Electronic_ISBN

978-92-75815-10-8

Type

conf

DOI

10.1109/EPE.2007.4417633

Filename

4417633