Innovative and Complete Dummy Filling Strategy for RF Inductors Integrated in an Advanced Copper BEOL

Author

Pastore, Carine ; Gianesello, Frederic ; Gloria, Daniel ; Serret, Emmanuelle ; Benech, Philippe

Author_Institution

STMicroelectronics, Crolles

fYear

2008

fDate

27-28 Oct. 2008

Firstpage

40

Lastpage

43

Abstract

A complete strategy to manage dummy fills inside and underneath a large spectrum of integrated RF inductors realized in a 0.13 mum CMOS technology using a Damascene Copper Back End of Line (BEOL) is presented here. The main motivation of this paper is first to evaluate through a Design Of Experiment (DOE) modeling, the impact on RF inductor performances of dummy fills inserted inside or underneath the coils, and then determine the right metal fill density to insert to be compliant with Digital metal density rules without degrading their electrical performances.

Keywords

CMOS integrated circuits; design of experiments; inductors; radiofrequency integrated circuits; damascene copper back end of line; design of experiment modeling; digital metal density; dummy fills; integrated RF inductors; CMOS technology; Coils; Copper; Filling; Inductors; Performance evaluation; Radio frequency; Semiconductor device modeling; Technology management; US Department of Energy;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European

Conference_Location

Amsterdam

Print_ISBN

978-2-87487-007-1

Type

conf

DOI

10.1109/EMICC.2008.4772223

Filename

4772223