Millimetre-wave Hot-Via interconnect-based GaAs chip-set for automotive RADAR and security sensors

Author

Alléaume, P.F. ; Toussain, C. ; Auvinet, C. ; Domnesque, D. ; Quentin, P. ; Camiade, M.

Author_Institution

United Monolithic Semicond., Orsay

fYear

2008

fDate

27-28 Oct. 2008

Firstpage

52

Lastpage

55

Abstract

New microwave front-ends are more and more integrated and operate commonly at very high frequencies above 40 GHz. So the chip to sub-system interconnections at millimetre-wave frequencies play as key factor to address the main system requirements which are generally a low cost, a high reliability level with of course the best electrical performances. UMS has developed a 77 GHz chip-set for automotive RADAR using a wire free connection called hot-via. This very broad band transition was optimised in W-band in order to remain compatible with the existing chip designs and to be realistic in term of industrialisation, cost and assembly in heterogeneous microwave sub-systems.

Keywords

integrated circuit interconnections; millimetre wave integrated circuits; reliability; W band; chip-set; frequency 77 GHz; microwave front-ends; millimetre-wave hot-via interconnect; reliability; Assembly; Automotive engineering; Chip scale packaging; Cost function; Design optimization; Frequency; Gallium arsenide; Radar; Security; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European

Conference_Location

Amsterdam

Print_ISBN

978-2-87487-007-1

Type

conf

DOI

10.1109/EMICC.2008.4772226

Filename

4772226