DocumentCode
2585285
Title
Surface Evolution of Strained Thin Solid Films: Stability Analysis and Time Evolution of Local Surface Perturbations
Author
Dornel, E. ; Barb, J-C ; Eymery, J. ; de Crecy, F.
Author_Institution
Leti-MINATEC D2NT/LSCDP, Grenoble
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
8
Abstract
A discrete formulation of the surface diffusion potential is developed taking into account both the capillarity and the elasticity contributions. This potential, also valid in the large curvature regime, is applied to study the surface evolution of strained thin solid films. The home made numerical tool MoveFilm, used to track the surface evolution due to surface diffusion, is coupled to a finite element solver Cast3M to calculate the mechanical problem. The numerical results are consistent with known analytic results in the small perturbation approximation. This validates the code and our formulation of the diffusion potential. To go further, some non-linear strain effects are analysed concerning the destabilization dynamics imposed by an initial local surface perturbation. For low biaxial strain (1%), the perturbation amplitude grows and reaches a maximum before a lateral expansion of the perturbation. During the evolution, the profile remains quasi-sinusoidal and selects a specific wavelength. For larger strain, a specific wavelength is also selected but the profile shape is highly asymmetric and exhibits sharp grooves similar to cracks.
Keywords
capillarity; elasticity; elemental semiconductors; finite element analysis; perturbation theory; semiconductor thin films; silicon; surface diffusion; Cast3M; MoveFilm; Si; capillarity; elasticity contribution; finite element solver; mechanical problem; nonlinear strain effects; numerical tool; stability analysis; strained thin solid silicon films; surface diffusion potential; surface perturbation approximations; Capacitive sensors; Elasticity; Equations; Finite element methods; Semiconductor films; Solids; Stability analysis; Surface cracks; Surface morphology; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.359946
Filename
4201143
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