DocumentCode :
2585438
Title :
AlGaN/GaN HEMT with over 110 W Output Power for X-Band
Author :
Zhong, ShiChang ; Chen, Tangsheng ; Ren, Chunjiang ; Jiao, Gang ; Chen, Chen ; Shao, Kai ; Yang, Naibin
Author_Institution :
Nat. Key Lab. of Monolithic Integrated Circuits & Modules, Nanjing Electron. Devices Inst., Nanjing
fYear :
2008
fDate :
27-28 Oct. 2008
Firstpage :
91
Lastpage :
94
Abstract :
AlGaN/GaN HEMT using field plate and recessed gate for X-band application was developed on SiC substrate. Internal matching circuits were designed to achieve high gain at 8 GHz for the developed device with single chip and four chips combining, respectively. The internally matched 5.52 mm single chip AlGaN/GaN HEMT exhibited 36.5 W CW output power with a power added efficiency (PAE) of 40.1% and power density of 6.6 W/mm at 35 V drain bias voltage (Vds). The device with four chips combining demonstrated a CW over 100 W across the band of 7.7-8.2 GHz, and an maximum CW output power of 119.1 W with PAE of 38.2% at Vds =31.5 V. This is the highest output power for AlGaN/GaN HEMT operated at X-band to the best of our knowledge.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; microwave power amplifiers; wide band gap semiconductors; AlGaN-GaN; CW output power; HEMT; SiC; SiC substrate; X-band application; drain bias voltage; field plate; frequency 7 GHz to 12.5 GHz; frequency 8 GHz; internal matching circuits; power 110 W; power added efficiency; power density; recessed gate; size 5.2 mm; solid-state power amplifiers; voltage 35 V; Aluminum gallium nitride; Circuits; Gallium nitride; HEMTs; Power amplifiers; Power generation; Pulse measurements; Silicon carbide; Substrates; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
Conference_Location :
Amsterdam
Print_ISBN :
978-2-87487-007-1
Type :
conf
DOI :
10.1109/EMICC.2008.4772236
Filename :
4772236
Link To Document :
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