Numerical Simulation and Thermal Failure Analysis of SOM Package

This paper presents a numerical analysis and experimental study on failure of the spatial optical modulators (SOM) package and its preventing from thermal damage. The SOM package has been developed for projection displays. Most heat sources of the SOM package were mounted on a glass plane that was coated with SiO₂ and TiO₂ for optical performance. The heat sources were distributed by entering the laser beam to the operating mirror, heating of IC chip and ohmic heating in the circuit of glass plane. In designing the SOM package, it is important to consider the thermal influence to the SOM package´s performance and reliability. In this study, the electrical and thermal simulation by CFD and experiments using infrared camera are carried out for the enhancement of thermal reliability. The results are in good agreement with the experiments results and the maximum temperature of glass plane was decreased by the change of glass plane structure change.