• DocumentCode
    2585526
  • Title

    Development of Ultrahigh-Speed InP/GaAsSb/InP DHBTs: Are Terahertz Bandwidth Transistors Realistic?

  • Author

    Bolognesi, C.R. ; Liu, H. ; Ostinelli, O. ; Zeng, Y.

  • Author_Institution
    THz Electron. Group, Inst. fur Feldtheorie und Hochstfrequenztechnik, Zurich
  • fYear
    2008
  • fDate
    27-28 Oct. 2008
  • Firstpage
    107
  • Lastpage
    110
  • Abstract
    In response to the continually increasing appetite for bandwidth, most transistor technologies have recently made great strides towards higher cutoff frequencies: Silicon MOSFETs, SiGe HBTs, InP-based HEMTs and a variety of InP -based HBTs all show cutoff frequencies fT and/or fMAX exceeding 300 GHz, and in some cases approaching 800 GHz. Proponents of various technologies have stated that the development of THz bandwidth devices is an attainable milestone for their technology of choice. Such ambitious goals naturally raise the question of whether such performances are in fact realistic given the well-known trends relating breakdown voltages and cutoff frequencies. Can the contending technologies be scaled in a way enabling THz cutoff frequencies while maintaining the well-behaved characteristics of less aggressively scaled previous generations? The present Invited Paper focuses on our efforts to push InP/GaAsSb DHBTs toward THz bandwidths.
  • Keywords
    III-V semiconductors; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; semiconductor device breakdown; submillimetre wave transistors; InP-GaAsSb-InP; breakdown voltages; cutoff frequencies; terahertz bandwidth transistors; ultrahigh-speed DHBT; Bandwidth; Cutoff frequency; Double heterojunction bipolar transistors; Germanium silicon alloys; HEMTs; Indium phosphide; MODFETs; MOSFETs; Silicon germanium; Submillimeter wave technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-2-87487-007-1
  • Type

    conf

  • DOI
    10.1109/EMICC.2008.4772240
  • Filename
    4772240