DocumentCode
2585526
Title
Development of Ultrahigh-Speed InP/GaAsSb/InP DHBTs: Are Terahertz Bandwidth Transistors Realistic?
Author
Bolognesi, C.R. ; Liu, H. ; Ostinelli, O. ; Zeng, Y.
Author_Institution
THz Electron. Group, Inst. fur Feldtheorie und Hochstfrequenztechnik, Zurich
fYear
2008
fDate
27-28 Oct. 2008
Firstpage
107
Lastpage
110
Abstract
In response to the continually increasing appetite for bandwidth, most transistor technologies have recently made great strides towards higher cutoff frequencies: Silicon MOSFETs, SiGe HBTs, InP-based HEMTs and a variety of InP -based HBTs all show cutoff frequencies fT and/or fMAX exceeding 300 GHz, and in some cases approaching 800 GHz. Proponents of various technologies have stated that the development of THz bandwidth devices is an attainable milestone for their technology of choice. Such ambitious goals naturally raise the question of whether such performances are in fact realistic given the well-known trends relating breakdown voltages and cutoff frequencies. Can the contending technologies be scaled in a way enabling THz cutoff frequencies while maintaining the well-behaved characteristics of less aggressively scaled previous generations? The present Invited Paper focuses on our efforts to push InP/GaAsSb DHBTs toward THz bandwidths.
Keywords
III-V semiconductors; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; semiconductor device breakdown; submillimetre wave transistors; InP-GaAsSb-InP; breakdown voltages; cutoff frequencies; terahertz bandwidth transistors; ultrahigh-speed DHBT; Bandwidth; Cutoff frequency; Double heterojunction bipolar transistors; Germanium silicon alloys; HEMTs; Indium phosphide; MODFETs; MOSFETs; Silicon germanium; Submillimeter wave technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
Conference_Location
Amsterdam
Print_ISBN
978-2-87487-007-1
Type
conf
DOI
10.1109/EMICC.2008.4772240
Filename
4772240
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