R-2 The Interconnect Crisis

Summary form only given. Can VLSI sustain the traditional rate of improvement in price and performance without integrating copper and low-K dielectrics into manufacturable processes? Which products will be the first to adopt these new materials? Will major insertion of these materials occur in the 0.25 um, 0.18 um, or subsequent generations? Several methods for copper line formation and many low-K dielectric constant materials are under study - which are examined in this session.