• DocumentCode
    2585803
  • Title

    Simulation of Failure Criteria in Dielectric Layers

  • Author

    Arshak, Khalil ; Guiney, Ivor ; Forde, Edward

  • Author_Institution
    Microelectron. & Semicond. Res. Group, Limerick Univ., Limerick
  • fYear
    2007
  • fDate
    16-18 April 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Breakdown in dielectric layers has previously been assumed to be dependent only on the electric field strength at a certain point in the dielectric lattice [1], [2]. This does not take quantum aspects of the lattice structure into account. The present model takes into account quantum variations of particles in conjunction with different particle characteristics. Dielectric breakdown patterns are characterised by their quantum breakdown probabilities and studies are carried out as a function of the applied electric field, temperature and specific material constants responsible for breakdown, such as the mean free path and the potential barrier present. How these quantities affect the breakdown probability of the dielectric layer is examined and this facilitates the prediction of failure in dielectric layers in semiconductor devices.
  • Keywords
    dielectric materials; electric breakdown; applied electric field; dielectric breakdown patterns; dielectric layers; failure criteria; lattice structure; mean free path; potential barrier; quantum aspects; quantum breakdown probabilities; semiconductor devices; specific material constants; Dielectric breakdown; Dielectric devices; Dielectric materials; Electric breakdown; Electric potential; Electrons; Laplace equations; Lattices; Semiconductor materials; Stochastic processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
  • Conference_Location
    London
  • Print_ISBN
    1-4244-1105-X
  • Electronic_ISBN
    1-4244-1106-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2007.360007
  • Filename
    4201174