DocumentCode :
2586025
Title :
Thermo-mechanical investigations on the effects of the solder meniscus design in solder joint lifetime for power electronic devices
Author :
Bouarroudj, M. ; Khatir, Z. ; Lefebvre, S. ; Dupont, L.
Author_Institution :
INRETS-LTN, Arcueil
fYear :
2007
fDate :
16-18 April 2007
Firstpage :
1
Lastpage :
7
Abstract :
The crack and delamination of solder joints between base plates and DCB substrates of power modules is one of the most frequently encountered failure mode and studied in literature. In this paper we present numerical effects of solder meniscus design in solder lifetime prediction. Especially, we show the effect of singular points, which appear in the border edges or corners of DCB or solder joints geometries, in mechanical stress, strain and plastic work evaluations. Furthermore the effect of mesh density on mechanical stress and strains is shown. Finally, we will see the effect of the meniscus design of the solder joint on lifetime estimation using both plastic strain-based and energy-based models.
Keywords :
cracks; delamination; failure analysis; finite element analysis; life testing; power semiconductor devices; semiconductor device reliability; semiconductor device testing; soldering; stress analysis; thermomechanical treatment; DCB substrates; base plates; delamination; energy-based models; failure mode; finite element analysis tool; mechanical strain; mechanical stress; power electronic devices; power modules; solder joint crack; solder joint lifetime; solder meniscus design; thermo-mechanical investigation; Capacitive sensors; Delamination; Geometry; Life estimation; Multichip modules; Plastics; Power electronics; Soldering; Stress; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location :
London
Print_ISBN :
1-4244-1105-X
Electronic_ISBN :
1-4244-1106-8
Type :
conf
DOI :
10.1109/ESIME.2007.360017
Filename :
4201184
Link To Document :
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