Development and Assessment of Global-Local Modeling Technique Used in Advanced Microelectronic Packaging

In this study, two types of global-local models are introduced. One is submodeling, in which a coarse global model is used to simulate the whole model and the fine local model is used to simulate the critical region of interest from whole model. The other is global-local-beam (GLB) model, in which the joint is replaced by an equivalent beam with effective stiffness. For submodeling, two different cut boundaries are compared and suitable cut boundary is proposed. In addition, the effective global-local model combining submodeling and GLB modeling technique is also introduced. Case study is presented in this paper. Firstly, PBGA assembly subjected to thermal cycling was investigated using global-local FEA modeling. Secondly, the GLB modeling was used in modal analysis for FCOB assembly. Thirdly, bending simulation was conducted for VQFN assembly using both two-level submodeling and one-level submodeling method.