The effect of board stiffness on the solder-joint reliability of HVQFN-packages

Author

De Vries, Jelle ; Jansen, M. ; van Driel, W.

Author_Institution

Philips Appl. Technol., Eindhoven

fYear

2007

fDate

16-18 April 2007

Firstpage

1

Lastpage

7

Abstract

In this work the results of thermal cycling tests on HVQFN-packages mounted on printed circuit boards are evaluated. The emphasis is on the fatigue life of the soldered interconnections as it is influenced by the printed circuit board, rather than that by the package or the solder. Data from different experimental set-ups are compared: panel thickness and stand-off height of the packages. New in this respect is inclusion of the base material of the panels as parameter. The test load was set to cycling at -40degC/+125degC and -20degC/+100degC. The results prove that the essential physical properties governing the fatigue life are the stiffness of the complete assembly and the thermal expansion mismatch between the parts. Numerical simulations support this.

Keywords

elastic constants; fatigue; integrated circuit interconnections; integrated circuit reliability; printed circuit design; solders; thermal expansion; HVQFN-packages; board stiffness; fatigue life; package stand-off height; panel thickness; printed circuit boards; solder-joint reliability; soldered interconnections; thermal cycling tests; thermal expansion; Circuit testing; Fatigue; Heat sinks; Integrated circuit interconnections; Lead; Numerical simulation; Packaging; Printed circuits; Space technology; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Conference_Location

London

Print_ISBN

1-4244-1105-X

Electronic_ISBN

1-4244-1106-8

Type

conf

DOI

10.1109/ESIME.2007.360021

Filename

4201188