DocumentCode
2586376
Title
Power cycling induced failure mechanisms in solder layers
Author
Herrmann, Tobias ; Feller, Marco ; Lutz, Josef ; Bayerer, Reinhold ; Licht, Thomas
Author_Institution
Tech. Univ. Chemnitz, Chemnitz
fYear
2007
fDate
2-5 Sept. 2007
Firstpage
1
Lastpage
7
Abstract
Improvements of power module technologies are investigated in different life time tests. Failure causes like solder fatigue become more important and a limiting factor for lifetime in power cycling tests. Different failure modes of solder joints in relation to power cycling conditions are shown.
Keywords
failure analysis; fatigue testing; life testing; power semiconductor devices; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; soldering; fatigue failure; life time tests; power cycling; power semiconductor module; semiconductor packaging; solder layer reliability; Bonding; Electronic packaging thermal management; Failure analysis; Insulated gate bipolar transistors; Life testing; Semiconductor device reliability; Soldering; Temperature; Thermal stresses; Wire; high temperature electronics; packaging; power cycling; power modules; reliability; semiconductor device; thermal stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2007 European Conference on
Conference_Location
Aalborg
Print_ISBN
978-92-75815-10-8
Electronic_ISBN
978-92-75815-10-8
Type
conf
DOI
10.1109/EPE.2007.4417702
Filename
4417702
Link To Document