• DocumentCode
    2586718
  • Title

    Design and Temperature Dependent Analysis of GaAs Multilayer Transmission Lines

  • Author

    Yuan, J. ; Rezazadeh, A.A. ; Lu, J. ; Sun, Q. ; Vo, V.T.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Univ. of Manchester, Manchester
  • fYear
    2008
  • fDate
    27-28 Oct. 2008
  • Firstpage
    378
  • Lastpage
    381
  • Abstract
    In multilayer technology, the generated heat can not be dissipated effectively due to its multilayer structure. In this paper we designed, fabricated and characterised a group of GaAs multilayer coplanar waveguide (CPW) transmission lines and studied the effects of temperature on these components. Furthermore a de-embedding technique has been applied and the effect of de-embedding shown to be critical in removing the pads parasitics. The temperature dependents of the transmission lines are carefully analyzed from -25degC to 125degC and the results indicated that the characteristic impedances and effective dielectric constants of the transmission lines remained constant within the temperature range. These results are reported for the first time and provide an insight into the design optimization of multilayer circuits for compact 3D MMIC applications.
  • Keywords
    III-V semiconductors; coplanar transmission lines; coplanar waveguides; gallium arsenide; multilayers; permittivity; 3D MMIC; GaAs; characteristic impedances; coplanar waveguide transmission lines; de-embedding technique; dielectric constants; multilayer structure; temperature -25 degC to 125 degC; Coplanar transmission lines; Coplanar waveguides; Distributed parameter circuits; Gallium arsenide; Impedance; Nonhomogeneous media; Temperature dependence; Temperature distribution; Transmission lines; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuit Conference, 2008. EuMIC 2008. European
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-2-87487-007-1
  • Type

    conf

  • DOI
    10.1109/EMICC.2008.4772308
  • Filename
    4772308