Title :
Study of CVD diamond films for thermal management in power electronics
Author :
Schneider, H. ; Locatelli, M.L. ; Achard, J. ; Scheid, E. ; Tounsi, P. ; Ding, H.
Author_Institution :
Univ. de Toulouse, Toulouse
Abstract :
Because of its high thermal conductivity and dielectric strength, diamond is a promising material for thermal management in high voltage, high power electronics. In this paper we present our investigation of CVD polycrystalline diamond films for heat sink applications. Dielectric strength and thermal conductivity have been measured at room temperature, for either home made or commercial samples. Though the measured dielectric strength remains lower than the 10 MV/cm expected value (greatly impacted by the surface polishing), the interest of diamond is confirmed.
Keywords :
chemical vapour deposition; diamond; electric strength; heat sinks; polishing; power electronics; thermal conductivity; thermal management (packaging); CVD; dielectric strength; heat sink; polycrystalline diamond films; power electronics; surface polishing; thermal conductivity; thermal management; Conducting materials; Dielectric breakdown; Dielectric materials; Dielectric measurements; Energy management; Power electronics; Temperature measurement; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal management; diamond; heat sink;
Conference_Titel :
Power Electronics and Applications, 2007 European Conference on
Conference_Location :
Aalborg
Print_ISBN :
978-92-75815-10-8
Electronic_ISBN :
978-92-75815-10-8
DOI :
10.1109/EPE.2007.4417729
