DocumentCode
2586937
Title
Impact of actively body-bias controlled (ABC) SOI SRAM by using direct body contact technology for low-voltage application
Author
Hirano, Y. ; Ipposhi, T. ; Dang, H. ; Matsumoto, T. ; Iwamatsu, T. ; Nii, K. ; Tsukamoto, Y. ; Yoshizawa, T. ; Kato, H. ; Maegawa, S. ; Arimoto, K. ; Inoue, Y. ; Inuishi, M. ; Ohji, Y.
Author_Institution
Adv. Device Dev. Dept., Renesas Technol. Corp, Hyogo, Japan
fYear
2003
fDate
8-10 Dec. 2003
Abstract
Actively Body-bias Controlled (ABC) SOI SRAM that has a new cell structure including connections of the access and the driver transistor´s bodies to the word line is proposed to realize low-voltage operation. We developed the direct body contact technology to apply forward biases to the bodies without area penalties and increases of parasitic gate capacitances by using the hybrid trench isolation for the first time. Moreover, the standby current does not change because the body bias is not applied when the word-line voltage is low level. It is successfully demonstrated that low-voltage and high-speed operation is achieved by using the ABC SOI SRAM.
Keywords
CMOS memory circuits; SRAM chips; isolation technology; low-power electronics; silicon-on-insulator; SOI SRAM; Si; actively body-bias controlled SRAM; direct body contact technology; forward biases; high-speed operation; hybrid trench isolation; low-voltage application; standby current; Clocks; Driver circuits; Energy consumption; Intersymbol interference; Isolation technology; Low voltage; MOSFET circuits; Parasitic capacitance; Random access memory; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7872-5
Type
conf
DOI
10.1109/IEDM.2003.1269160
Filename
1269160
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