DocumentCode
2587127
Title
The Changing Role of CFD in Electronics Thermal Design
Author
Parry, John
Author_Institution
Flomerics Ltd., East Molesey
fYear
2007
fDate
16-18 April 2007
Firstpage
1
Lastpage
1
Abstract
The presentation will discuss how the use of computational fluid dynamics (CFD) technology in the thermal design of electronics systems has changed since its earliest use in electronics design in the late 1980s.
Keywords
computational fluid dynamics; thermal management (packaging); CFD; computational fluid dynamics; electronics thermal design; thermal mangement; Bridges; Computational fluid dynamics; Consumer electronics; Demography; Design engineering; Electronic design automation and methodology; Electronic packaging thermal management; Heat engines; Power engineering and energy; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on
Conference_Location
London
Print_ISBN
1-4244-1105-X
Electronic_ISBN
1-4244-1106-8
Type
conf
DOI
10.1109/ESIME.2007.360070
Filename
4201237
Link To Document