Digital and Continuous Liquid Cooling for Electronic Systems

Author

Baelmans, M. ; Oprins, H. ; Stevens, T. ; Rogiers, F.

Author_Institution

Dept. of Mech. Eng., Katholieke Univ. Leuven, Leuven

fYear

2007

fDate

16-18 April 2007

Firstpage

1

Lastpage

7

Abstract

In this paper both digital and liquid cooling concepts are proposed. Microchannel cooling techniques either actuated by a separate feed pump or actuated by electrowetting are investigated and their cooling capabilities and pumping requirements are assessed. Though the continuous liquid microchannel cooling clearly outperforms the other systems with respect to global thermal resistances, the low energy consumption and the flexibility as a reconfigurable cooling system, make the electro-actuated cooling systems attractive.

Keywords

cooling; drops; electronics packaging; electrostatic actuators; heat sinks; microchannel flow; thermal resistance; wetting; continuous liquid cooling; digital cooling; digital droplet flow; electroactuation; electronic system cooling; electrostatic actuation; electrowetting; feed pump; fluid flow; global thermal resistance; heat sink; microchannel cooling; reconfigurable system; Consumer electronics; Electronics cooling; Feeds; Geometry; Heat sinks; Heat transfer; Liquid cooling; Microchannel; Resistance heating; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. International Conference on

Conference_Location

London

Print_ISBN

1-4244-1105-X

Electronic_ISBN

1-4244-1106-8

Type

conf

DOI

10.1109/ESIME.2007.360071

Filename

4201238