Title :
High-voltage pulse stress on biomedical ultrasound probe soldered with Ag-ECA
Author :
Catelani, Marcantonio ; Scarano, Valeria L. ; Bertocci, Francesco ; Singuaroli, Roberto
Author_Institution :
Dept. of Electron. & Telecommun., Univ. of Florence, Firenze, Italy
fDate :
April 30 2010-May 1 2010
Abstract :
In this paper the results from a study of high-voltage pulse stressing effects on ultrasound array transducers are presented. The ultrasound transducers have been implemented with a new Pb-free soldering technology, using Silver Electrically Conductive Adhesive. The conductive adhesive have been used among the platelet of piezoelectric and fingers of connection for the implementation of phased array transducer. In order to evaluate the reliability of the biomedical instrument electrical tests are proposed. Some experimental results through a measurement system for the electro-acoustic characterization of the medical probe before and after stress test are obtained and analyzed.
Keywords :
adhesives; bioelectric phenomena; biomedical materials; biomedical ultrasonics; silver; Pb-free soldering technology; biomedical instrument electrical tests; biomedical ultrasound probe; electro-acoustic characterization; high-voltage pulse stress; high-voltage pulse stressing effects; medical probe; phased array transducer; piezoelectric platelet; silver electrically conductive adhesive; soldering; ultrasound array transducers; Biomedical measurements; Biomedical transducers; Conductive adhesives; Phased arrays; Piezoelectric transducers; Probes; Stress; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers; Ag-ECA; electrical stress test; high-voltage pulse; phased array probe; silver electrically conductive adhesive; ultrasound piezoelectric transducer;
Conference_Titel :
Medical Measurements and Applications Proceedings (MeMeA), 2010 IEEE International Workshop on
Conference_Location :
Ottawa, ON
Print_ISBN :
978-1-4244-6288-9
DOI :
10.1109/MEMEA.2010.5480214
