Advanced composite materials with tailored thermal properties for heat sink applications

Materials which are used as heat sinks should have a high thermal conductivity combined with a low coefficient of thermal expansion (CTE). Future electronic components will require heat sink materials with thermal conductivities above 300 W/mK and adapted CTEs which can be realized by diamond based composites. Aluminum and Copper-Diamond Composites have been manufactured by a powder metallurgical process. Surface coated diamonds or copper alloys have been used to prepare composites which are characterized by a stable thermal and mechanical interface. This was confirmed by measurement of thermal properties before and after thermal cycling. The used manufacturing process is a cost efficient technique which also allows to some degree the freedom for manufacturing of near net shape parts or composite parts with a high surface quality.