DocumentCode
2589002
Title
Few electron memories: finding the compromise between performance, variability and manufacturability at the nano-scale
Author
Silva, H. ; Kim, M.K. ; Kumar, A. ; Avci, U. ; Tiwari, S.
Author_Institution
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
fYear
2003
fDate
8-10 Dec. 2003
Abstract
The key challenges for memories that operate at the nanoscale, and are compatible with mainstream nano-scale CMOS, are in achieving the performance characteristics that are useful at massive integration and in the reproducibility necessary for manufacturing. Use of single or few electrons, by utilizing the reduced dimensions - smaller number of states and larger charging energies - while appealing as a concept, needs to address the increased variance, smaller signal, and numerous other consequences of reduced collective phenomena. Several key ideas of recent times, from the use of nanocrystals to defects and decoupling of storage from the read process, provide paths where power, speed, technology compatibility, and variability is addressed. This paper discusses several of these approaches and their attributes, focusing on finding the design compromises for usability and manufacturability.
Keywords
CMOS memory circuits; nanoelectronics; nanostructured materials; single electron devices; back-gates; back-trapping; charging energy; defect-trapping; few electron memories; floating-gate methods; manufacturability; manufacturing reproducibility; massive integration; nanocrystal memories; nanoscale CMOS memories; nanoscale variability; read process decoupling; reduced dimensions; single electron transistor; single-electron effect; state number reduction; technology compatibility; variance; Computer aided manufacturing; Computer integrated manufacturing; Electrons; Impedance; Nanocrystals; Physics computing; Pulp manufacturing; Reproducibility of results; Silicon on insulator technology; Usability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7872-5
Type
conf
DOI
10.1109/IEDM.2003.1269277
Filename
1269277
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