Title :
Live demonstration: A 3D die-level integration platform
Author :
Chih-Chyau Yang ; Yi-Jun Liu ; Chien-Ming Wu ; Chun-Ming Huang
Author_Institution :
Nat. Appl. Res. Labs., Nat. Chip Implementation Center, Hsinchu, Taiwan
Abstract :
This paper presents a three-dimensional (3D) die-level integration platform, MorPACK. The structure of MorPACK is 3D stacked by the connection modules and circuit modules. It makes MorPACK platform own heterogeneous integration capabilities. With proper system partition and tri-state interface connection, the MorPACK system can be extended by the peripheral interfaces efficiently and alternate the functions by only updating the bare die/module. In this paper, the die-level functional substrates, the MorPACK modules, and a digital photo frame demo system are demonstrated and run with MorPACK platform to show how the academics/industries can prototype their circuits/system design with the MorPACK platform.
Keywords :
integrated circuit design; integrated circuit packaging; modules; peripheral interfaces; three-dimensional integrated circuits; 3D die-level integration platform; 3D stacking; MorPACK platform; circuit module; connection module; die-level functional substrate; digital photo frame demo system; heterogeneous integration capability; morphing package; peripheral interface; three-dimensional die-level integration platform; tristate interface connection; Central Processing Unit; Hardware; IP networks; Prototypes; Substrates; System-on-chip; Three-dimensional displays; 3D Die-level integration Platform; Prototyping platform;
Conference_Titel :
Circuits and Systems (APCCAS), 2014 IEEE Asia Pacific Conference on
Conference_Location :
Ishigaki
DOI :
10.1109/APCCAS.2014.7032750
