Substrate transfer: enabling technology for RF applications

Author

Dekker, R. ; Dessein, K. ; Fock, J.-H. ; Gakis, A. ; Jonville, C. ; Kuijken, O.M. ; Michielsen, T.M. ; Mijlemans, P. ; Pohlmann, H. ; Schnitt, W. ; Timmering, C.E. ; Tombeur, A.M.H.

Author_Institution

Philips Res., Eindhoven, Netherlands

fYear

2003

fDate

8-10 Dec. 2003

Abstract

Substrate transfer is proposed as a wafer-scale postprocessing technology to transfer circuits processed with standard IC processing to an alternative substrate e.g. glass. The advantages of the complete elimination of RF coupling to the resistive silicon substrate are illustrated by several examples. The application of substrate transfer to III-V IC processes is proposed, and its extension to flexible ultra-thin circuits based on mono-crystalline silicon is demonstrated.

Keywords

III-V semiconductors; adhesive bonding; elemental semiconductors; integrated circuit manufacture; printed circuit manufacture; radiofrequency integrated circuits; silicon; substrates; wafer bonding; III-V IC processes; RF application enabling technology; Si; alternative substrate; backend process step; flexible ultra-thin circuits; glass substrate; gluing; monocrystalline silicon; substrate RF coupling; substrate transfer; wafer-scale post-processing technology; Application specific integrated circuits; Coupling circuits; Dielectric substrates; Flexible printed circuits; Glass; Isolation technology; Radio frequency; Silicon; Temperature; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International

Conference_Location

Washington, DC, USA

Print_ISBN

0-7803-7872-5

Type

conf

DOI

10.1109/IEDM.2003.1269301

Filename

1269301