Title :
Enhancement of micromechanical resonator manufacturing precision via mechanically-coupled arraying
Author :
Lin, Yang ; Li, Wei-Chang ; Kim, Bongsang ; Lin, Yu-Wei ; Ren, Zeying ; Nguyen, Clark T -C
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
A statistical comparison between the resonance frequency variations of stand-alone micromechanical disk resonators and mechanically-coupled array composites of them reveals that mechanically-coupled arraying of on-chip micromechanical resonators can very effectively enhance the manufacturing repeatability of resonance frequencies. In particular, twenty 3-disk resonator array-composites on a single die achieve a measured resonance frequency standard deviation as small as 165.7 ppm around a 61.25 MHz average, which is significantly smaller than the 316.4 ppm measured for twenty stand-alone disk resonators on the same die. This new standard deviation reduces the expected filter percent bandwidth achievable with a 90% confidence interval without the need for trimming from the 1.89% of previous work to now just 0.86%. Larger arrays should further reduce the frequency standard deviation, perhaps to the point of allowing trim-free RF channel-select bandwidths with reasonable manufacturing confidence interval.
Keywords :
micromechanical resonators; resonator filters; 3-disk resonator array-composites; mechanical circuit; mechanically-coupled arraying; micromechanical filter; micromechanical resonator manufacturing precision; resonance frequency variations; stand-alone micromechanical disk resonators; standard deviation; wireless communications; Bandwidth; Frequency measurement; Manufacturing; Measurement standards; Micromechanical devices; Particle measurements; Radio frequency; Resonance; Resonant frequency; Resonator filters; LSI; MEMS; RF MEMS; VLSI; mechanical circuit; micromechanical filter; standard deviation; wireless communications;
Conference_Titel :
Frequency Control Symposium, 2009 Joint with the 22nd European Frequency and Time forum. IEEE International
Conference_Location :
Besancon
Print_ISBN :
978-1-4244-3511-1
Electronic_ISBN :
1075-6787
DOI :
10.1109/FREQ.2009.5168142