• DocumentCode
    2589673
  • Title

    Characterization of Crosstalk Effects in Double-Walled Carbon Nanotube (DWCNT) Bundle Bus Architecture

  • Author

    Pu, ShaoNing ; Mao, Junfa

  • Author_Institution
    Sch. of Electron., Inf. & Electr. Eng., Shanghai Jiao Tong Univ., Shanghai
  • fYear
    2008
  • fDate
    10-12 Sept. 2008
  • Firstpage
    467
  • Lastpage
    470
  • Abstract
    The crosstalk effects in single- and double-walled carbon nanotube bundle bus architectures are investigated and compared in this paper. New equivalent circuit models are proposed for both the single- and double-walled carbon nanotube bundles. It is found that (a) compared to single-walled carbon nanotube (SWCNT) bundle, a double-walled carbon nanotube (DWCNT) bundle bus can lead to a reduction of the crosstalk induced time delay by about 50%, and a slight reduction of delay uncertainty when the tubes are long; and (b) the peak voltage of the crosstalk induced glitch in the SWCNT bundle is lower than that in the DWCNT bundle, but the glitch duration time of the SWCNT bundle is longer than its DWCNT counterpart. These results confirm that the DWCNT bundle bus is more suitable for the next generation of bus technology and its overall performance will be better than that of SWCNT bundles.
  • Keywords
    carbon nanotubes; crosstalk; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; nanoelectronics; C; DWCNT; bus technology; crosstalk effects; crosstalk induced time delay; delay uncertainty reduction; double-walled carbon nanotube bundle bus architecture; equivalent circuit model; integrated circuit interconnects; Capacitance; Carbon nanotubes; Contact resistance; Copper; Crosstalk; Delay effects; Electronic mail; Equivalent circuits; Integrated circuit interconnections; Uncertainty; bus architecture; crosstalk; double-walled carbon nanotube (DWCNT) bundles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008 China-Japan Joint
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3821-1
  • Type

    conf

  • DOI
    10.1109/CJMW.2008.4772470
  • Filename
    4772470