Implementation of temperature dependent contact resistance model for the analysis of deep submicron devices under ESD

The specific contact resistance (/spl rho//sub c/) at the metal/semiconductor interface is known to be a monotonically decreasing function of temperature. Therefore the temperature dependence of /spl rho//sub c/ has significant implications for the reliable electrothermal behavior of deep submicron devices under high current and high temperature conditions. In this work, the effect of contact resistance on the performance of ESD protection devices has been investigated by device simulation and experiment with test structures in a 0.13 /spl mu/m silicided CMOS process. A temperature-dependent model for /spl rho//sub c/ was implemented in a device simulator; results based on the new model are presented in comparison with results of a self-consistent Schottky diode model which unifies thermionic emission and tunneling effects.