DocumentCode :
2590599
Title :
Modeling interconnect variability using efficient parametric model order reduction
Author :
Peng Li ; Liu, Frank ; Xin Li ; Pileggi, L.T. ; Nassif, S.R.
Author_Institution :
Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
fYear :
2005
fDate :
7-11 March 2005
Firstpage :
958
Abstract :
Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parametric interconnect models is often hampered by the rapid increase in computational cost and model complexity. In this paper we present an efficient yet accurate parametric model order reduction algorithm for addressing the variability of IC interconnect performance. The efficiency of the approach lies in a novel combination of low-rank matrix approximation and multi-parameter moment matching. The complexity of the proposed parametric model order reduction is as low as that of a standard Krylov subspace method when applied to a nominal system. Under the projection-based framework, our algorithm also preserves the passivity of the resulting parametric models.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit modelling; matrix algebra; method of moments; reduced order systems; DSM designs; IC interconnect performance; IC manufacturing process fluctuations; Krylov subspace method; computational cost; interconnect variability modeling; low-rank matrix approximation; model complexity; multi-parameter moment matching; parametric interconnect models; parametric model order reduction; parametric model passivity; projection-based framework; Computational efficiency; Costs; Fluctuations; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Manufacturing processes; Parametric statistics; Performance analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe, 2005. Proceedings
Conference_Location :
Munich, Germany
ISSN :
1530-1591
Print_ISBN :
0-7695-2288-2
Type :
conf
DOI :
10.1109/DATE.2005.213
Filename :
1395711
Link To Document :
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