DocumentCode :
2590674
Title :
Ultra-low thermal budget CMOS process for 65nm-node low-operation-power applications
Author :
Ootsuka, F. ; Ozaki, H. ; Sasaki, T. ; Yamashita, K. ; Takada, H. ; Izumi, N. ; Nakagawa, Y. ; Hayashi, M. ; Kiyono, K. ; Yasuhira, M. ; Arikado, T.
Author_Institution :
Semicond. Leading Edge Technol. Inc., Ibaraki, Japan
fYear :
2003
fDate :
8-10 Dec. 2003
Abstract :
This paper describes the fabrication process and the performance of 65 nm-node CMOS transistors which have ultra-shallow junctions. Flash lamp annealing enhances the drivability of pFETs with a solid phase epitaxial extension junction. The increase in the junction leakage of the extension junction is less than 1 order of magnitude as compared with that for the conventional spike RTA on a 300 mm/spl phi/ wafer. Excellent Vth control at 35 nm gate length without halo implantation and a high switching speed at 0.9 V power supply are demonstrated for 65 nm-node LOP (low operation power) applications.
Keywords :
CMOS integrated circuits; MOSFET; annealing; low-power electronics; 0.9 V; 150 mm; 35 nm; 65 nm; CMOS transistors; extension junction leakage; flash lamp annealing; high switching speed; low power operation; pFETs; solid phase epitaxial extension junction; ultra-low thermal budget CMOS process; ultra-shallow junctions; Annealing; CMOS process; CMOS technology; Fabrication; Ion implantation; Lamps; Lead compounds; Oxidation; Power supplies; Solids;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
Type :
conf
DOI :
10.1109/IEDM.2003.1269364
Filename :
1269364
Link To Document :
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