• DocumentCode
    2591015
  • Title

    Advancements in complementary carbon nanotube field-effect transistors

  • Author

    Javey, A. ; Qian Wang ; Woong Kim ; Hongjie Dai

  • Author_Institution
    Dept. of Chem., Stanford Univ., CA, USA
  • fYear
    2003
  • fDate
    8-10 Dec. 2003
  • Abstract
    High performance p- and n-type single-walled carbon nanotube (SWNT) field-effect transistors (FETs) are obtained by using high and low work function metals, Pd and Al as source/drain (S/D) electrodes respectively. Ohmic contacts made to chemically intrinsic SWNTs, with no or small Schottky barriers (SB), afford high ON-state currents up to 20 /spl mu/A per tube. The lack of significant Fermi-level pinning at the nanotube-metal interfaces allows for fine-tuning of the barrier heights for p-and n-channel conductions by changing the contact metals. The air-stable p- and n-FETs thus obtained can be used for complementary nanoelectronics, as demonstrated with the fabrication of an inverter. Other important issues regarding nanotube FETs including hysteresis, OFF-state leakage currents, choice of nanotube diameter, and threshold voltage control are discussed.
  • Keywords
    aluminium alloys; carbon nanotubes; field effect transistors; leakage currents; nanoelectronics; ohmic contacts; palladium; work function; 20 muA; Fermi-level pinning; OFF-state leakage currents; Pd-C-Al; Schottky barriers; barrier height fine-tuning; complementary carbon nanotube FET; complementary nanoelectronics; field-effect transistors; high work function metals; hysteresis; inverter; low work function metals; n-FET; n-type SWNT; nanotube diameter; nanotube-metal interfaces; ohmic contacts; p-FET; p-type SWNT; single-walled carbon nanotube FET; source/drain electrodes; threshold voltage control; CNTFETs; Carbon nanotubes; Chemicals; Electrodes; FETs; Fabrication; Inverters; Nanoelectronics; Ohmic contacts; Schottky barriers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7872-5
  • Type

    conf

  • DOI
    10.1109/IEDM.2003.1269387
  • Filename
    1269387