• DocumentCode
    2591395
  • Title

    Disassembly simulation for an effective recycling of electrical scrap

  • Author

    Hesselbach, Jürgen ; Westernhagen, Karsten V.

  • Author_Institution
    Inst. of Production Autom. & Handling Technol., Tech. Univ. Braunschweig, Germany
  • fYear
    1999
  • fDate
    1-3 Feb 1999
  • Firstpage
    582
  • Lastpage
    585
  • Abstract
    Disassembly of worn-out products, e.g. electronic products, without a careful planning of the processes may make recycling of such electrical scrap costly and inefficient. Computer assisted methods to support systematic planning of disassembly processes can help to increase the productivity and to improve the environmental-friendly removal of this kind of worn-out product. The paper introduces a software-tool, so-called LaySiD (Lay out Simulation for Disassembly), that includes a few modules to support the phases of planning disassembly. Methods of classifying electronic devices into disassembly-families with respect to their dismantling-related attributes are outlined. Further methods include the generation of flexible disassembly systems and the simulation of disassembly processes. The methods are applied to a spectrum of electronic devices that were analyzed in a dismantling experiment. The depicted tool may allow companies involved in dismantling and recycling of electrical scrap to optimize their disassembly processes and to improve productivity in recycling electrical scrap
  • Keywords
    digital simulation; electronic engineering computing; planning; recycling; software packages; Lay out Simulation for Disassembly; LaySiD; computer assisted methods; disassembly simulation; disassembly-families; dismantling-related attributes; electrical scrap recycling; electronic device; electronic devices classification; electronic scrap; productivity increase; software-tool; systematic disassembly planning; worn-out products disassembly; Automation; Consumer electronics; Hazardous materials; Process planning; Production planning; Productivity; Recycling; System testing; Technology planning; Telephony;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-7695-0007-2
  • Type

    conf

  • DOI
    10.1109/ECODIM.1999.747679
  • Filename
    747679