Title :
Active disassembly of bonded wafers
Author :
Kasa, Daijiro ; Suga, Tadatomo
Author_Institution :
Res. Center for Adv. Sci. & Technol., Tokyo Univ., Japan
Abstract :
In this paper, the new concept of design for disassembly, “active disassembly” is discussed. This concept proposes that products should have some structures or actuators to contribute to the disassembly themselves. A simple model of active disassembly is also considered. The model is two Si wafers bonded with water and they will be debonded when the water, which exists between two wafers, is heated and evaporates. The amounts of water required to separate the bond are estimated
Keywords :
design for environment; elemental semiconductors; silicon; wafer bonding; water; Si; Si wafers debonding; active disassembly; actuators; bond separation; bonded silicon wafers; design for disassembly; design for environment; water bonded Si wafers; water heating; Actuators; Ducts; Process design; Product design; Recycling; Semiconductor device modeling; Wafer bonding; Water conservation; Water heating; Water pollution;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo
Print_ISBN :
0-7695-0007-2
DOI :
10.1109/ECODIM.1999.747680
