Title :
Reversible interconnection using hydrogen storage alloy
Author :
Kitaoka, Fumiya ; Hosoda, Naoe ; Suga, Tadatomo
Author_Institution :
Res. Center for Adv. Sci. & Technol., Tokyo Univ., Japan
Abstract :
Most metallurgical bonds are difficult to separate and it is one of the reasons why the recycling of used electronics products is difficult. We have proposed a concept of “reversible interconnection” as the method which enables the different materials to be bonded and separated reversibly. In this study, hydrogen storage alloy (HSA) is used as an intermediate for bonding in order to realize the reversible interconnection. In the experiments, two aluminum pieces are bonded through LaNi4.5Al0.5 by a surface activated bonding method. This joint is separated in a hydrogen atmosphere by hydrogenation and pulverization of the HSA. In addition, the property of MmNi4.5Al0.5 is investigated to realize a selective disassembly
Keywords :
aluminium alloys; design for environment; hydrogen economy; hydrogenation; joining processes; lanthanum alloys; nickel alloys; recycling; LaNi4.5Al0.5; MmNi4.5Al0.5; aluminum pieces bonding; hydrogen atmosphere; hydrogen storage alloy; hydrogenation; metallurgical bonds separation; pulverization; reversible interconnection; selective disassembly; surface activated bonding method; used electronics products recycling; Bonding; Ducts; Hydrogen storage; Intermetallic; LAN interconnection; Material storage; Pollution; Recycling; Soldering; Temperature;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo
Print_ISBN :
0-7695-0007-2
DOI :
10.1109/ECODIM.1999.747682
