DocumentCode
2591499
Title
Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system
Author
Habu, Kazutaka ; Takeda, Naoko ; Watanabe, Haruo ; Ooki, Hiroshi ; Abe, Jiro ; Saito, Takashi ; Taniguchi, Yoshikuni ; Takayama, Kinjiro
Author_Institution
Center for Environ. Technol., Sony Corp., Yokohama, Japan
fYear
1999
fDate
1-3 Feb 1999
Firstpage
606
Lastpage
609
Abstract
Environmental concerns have led the authors to develop a lead-free solder. Their observation that a small amount of Ge drastically improves solderability and reliability of SnAg alloys resulted in the development of a novel lead-free solder alloys with a composition of Sn-20Ag-4.0Bi-0.5Cu-0.1Ge. They also confirmed that the developed solder was usable in conventional soldering machines without changing operational conditions
Keywords
bismuth alloys; copper alloys; environmental factors; germanium alloys; reliability; silver alloys; soldering; tin alloys; Sn-20Ag-4.0Bi-0.5Cu-0.1Ge lead-free solder; SnAgBiCuGe; environmental concerns; lead-free solder alloys; reliability; solderability; soldering machines; Bismuth; Copper alloys; Environmentally friendly manufacturing techniques; Germanium alloys; Lead; Mechanical factors; Pollution; Production engineering; Soldering; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location
Tokyo
Print_ISBN
0-7695-0007-2
Type
conf
DOI
10.1109/ECODIM.1999.747684
Filename
747684
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