DocumentCode
2591504
Title
Evaluation of Pb-free solders for adaptability to various soldering processes
Author
Tsunematsu, Yushi ; Tanigami, Masanobu ; Hirano, Masao
Author_Institution
Production Eng. Center, Omron Corp., Shiga, Japan
fYear
1999
fDate
1-3 Feb 1999
Firstpage
610
Lastpage
614
Abstract
In this paper, the authors evaluated the efficiency and productivity of an SMT and iron-machine soldering process using Sn-Ag-Cu type solders. This solder is superior to conventional ones in terms of strength, heat fatigue resistance and toughness. The results obtained are as follows: (1) in SMT processes using Sn-Ag-Cu type solders, the quality of products and efficiency obtained are similar to conventional solders, when small electric parts are selected; and (2) in iron-machine soldering processes, Sn-Ag-Cu solder is similar to conventional solders when the iron temperature is high
Keywords
copper alloys; environmental factors; silver alloys; soldering; tin alloys; SMT soldering process; SnAgCu; SnAgCu lead-free solders; heat fatigue resistance; iron temperature; iron-machine soldering process; strength; toughness; Creep; Electronics packaging; Fatigue; Lead; Production engineering; Productivity; Resistance heating; Soldering; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location
Tokyo
Print_ISBN
0-7695-0007-2
Type
conf
DOI
10.1109/ECODIM.1999.747685
Filename
747685
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