Title :
Yield modeling in a custom IC manufacturing line
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
Abstract :
A methodology used to implement yield modeling in a custom integrated-circuit manufacturing facility is described. The sources for the inputs to the models are described. The component approach to yield modeling is explained, where component defect density (D0 ) information is used to build an overall yield prediction. A reverse model using a single D0 number is detailed. Verifications and selection criteria are given for model selection
Keywords :
integrated circuit manufacture; monolithic integrated circuits; semiconductor device models; component approach; component defect density; custom IC manufacturing line; model selection; selection criteria; yield modeling; Application specific integrated circuits; Area measurement; Circuit faults; Circuit testing; Density measurement; Integrated circuit modeling; Integrated circuit yield; Predictive models; Semiconductor device measurement; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Conference_Location :
Danvers, MA
DOI :
10.1109/ASMC.1990.111226
