Title :
The physical mechanisms of defect clustering and its correlation to yield model parameters for yield improvement
Author :
Collica, Randall S.
Author_Institution :
Digital Equipment Corp., Hudson, MA, USA
Abstract :
The superposition principle is used to analyze faults of different mechanisms. The sum of individual cluster coefficients is approximately equal to the cluster coefficient for all mechanisms combined. A regression analysis of empirical data is used to demonstrate the concept. The actual fault density is compared to the model fault density and shows excellent agreement. The application of this model to actual chip yields is shown to be more accurate but also contain information about the relative number of fault generating mechanisms for the mask level of interest in the process. Future applications and areas of further work are given
Keywords :
fault location; integrated circuit manufacture; masks; semiconductor device models; cluster coefficients; defect clustering; empirical data; fault density; fault generating mechanisms; mask level; model parameters; regression analysis; superposition principle; yield improvement; Circuit faults; History; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit yield; Manufacturing processes; Probability; Regression analysis; Semiconductor device modeling; Statistical distributions;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Conference_Location :
Danvers, MA
DOI :
10.1109/ASMC.1990.111227
