Title :
UHF micromechanical extensional wine-glass mode ring resonators
Author :
Yuan Xie ; Sheng-Shian Li ; Yu-Wei Lin ; Zeying Ren ; Nguyen, C.T.C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Vibrating polysilicon micromechanical ring resonators, utilizing a unique extensional wine-glass mode shape to achieve lower impedance than previous UHF resonators, have been demonstrated at frequencies as high as 1.2-GHz with a Q of 3,700, and 1.47-GHz (highest to date) with a Q of 2,300. The 1.2-GHz resonator exhibits a measured motional resistance of 560 k/spl Omega/ with a dc-bias voltage of 20 V, which is 6/spl times/ lower than measured on radial contour mode disk counterparts at the same frequency, and which can be driven down as low as 2 k/spl Omega/ when a dc-bias voltage of 100 V and electrode-to-resonator gap spacing of 460 /spl Aring/ are used. The above high Q and low impedance advantages, together with the multiple frequency, on-chip integration advantages afforded by electrostatically-transduced /spl mu/mechanical resonators, make this device an attractive candidate for use in the front-end RF filtering and oscillator functions needed by wireless communication devices.
Keywords :
Q-factor; UHF generation; electrostatic devices; micromechanical resonators; 1.2 GHz; 1.47 GHz; 100 V; 2 kohm; 20 V; 460 /spl Aring/; 560 kohm; Q factor; UHF ring resonators; dc-bias voltage; electrode-to-resonator gap spacing; electrostatically-transduced resonators; extensional wine-glass mode shape; front-end RF filtering; front-end oscillator functions; micromechanical ring resonators; motional resistance; multiple frequency on-chip integration; resonator impedance; vibrating polysilicon resonators; wireless communication devices; Electrical resistance measurement; Frequency measurement; Impedance; Micromechanical devices; Optical ring resonators; Radio frequency; Resonator filters; Shape; UHF measurements; Voltage;
Conference_Titel :
Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7872-5
DOI :
10.1109/IEDM.2003.1269436