Title :
Assembly and interconnection of microsystems
Author_Institution :
TWI, Cambridge, UK
Abstract :
The objective of this paper is to provide an overview of technologies and materials available for Microsystems Assembly and Interconnection
Keywords :
microassembling; assembly; interconnection; microsystem;
Conference_Titel :
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19970019
