DocumentCode
2592055
Title
Temperature control system for infrared soldering
Author
Oncea, Gabriel ; Toderean, Gavril ; Buza, Ovidiu
Author_Institution
Dept. of Telecommun., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
fYear
2012
fDate
24-27 May 2012
Firstpage
564
Lastpage
568
Abstract
Our goal was to develop a low cost infrared soldering machine, to be used for BGA (Ball Grid Array) and SMD (Surface Mount Device) devices. This article describes the hardware and software structure of the machine and the experimental results.
Keywords
ball grid arrays; control engineering computing; soldering equipment; surface mount technology; temperature control; BGA; SMD devices; ball grid array; hardware structure; infrared soldering machine; software structure; surface mount device; temperature control system; Digital filters; Firing; Microcontrollers; Software; Soldering; Temperature control; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Automation Quality and Testing Robotics (AQTR), 2012 IEEE International Conference on
Conference_Location
Cluj-Napoca
Print_ISBN
978-1-4673-0701-7
Type
conf
DOI
10.1109/AQTR.2012.6237774
Filename
6237774
Link To Document