• DocumentCode
    2592208
  • Title

    Packaging for microengineered devices. Lessons from the real world

  • Author

    Beardmore, Geoff

  • fYear
    1997
  • fDate
    35487
  • Firstpage
    42401
  • Lastpage
    42408
  • Abstract
    This presentation reviews just a small selection of the lessons learned and experience gained in packaging small electro-mechanical devices and instruments, and suggests that many of these ideas could be relevant to the packaging and interconnection of future MEMS devices
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19970020
  • Filename
    597320
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2592208