A novel 3-DOF high acceleration/high precision robot optimal design and experimental verification

Author

Ding, Qingyong ; Sun, Lining ; Liu, Xinyu ; Ji, Junhong

Author_Institution

Robotics Inst., Harbin Inst. of Technol., China

fYear

2005

fDate

2-6 Aug. 2005

Firstpage

289

Lastpage

294

Abstract

This paper presents a novel 3-DOF hybrid kinematics robot composed of planar parallel mechanism including parallelogram linkages and linear drive, which are used for wire bonding of microelectronic device. Combining the advantages of parallel mechanism and direct drive, the robot can achieve high precision and high acceleration. The structure of the robot is optimized from the view of both kinematics and dynamics respectively. The experimental results demonstrated that the repeatability, acceleration and settling time of the robot can satisfy the proposed application.

Keywords

couplings; integrated circuit bonding; robot dynamics; robot kinematics; robotic assembly; direct drive; hybrid kinematics robot; microelectronic device; parallelogram linkage; planar parallel mechanism; robot dynamics; robot optimal design; wire bonding; Acceleration; Bonding processes; Coils; Hydraulic actuators; Hysteresis motors; Kinematics; Microelectronics; Packaging machines; Parallel robots; Robotics and automation; bonding process; direct-drive; high acceleration/high precision; hybrid kinematics robot;

fLanguage

English

Publisher

ieee

Conference_Titel

Intelligent Robots and Systems, 2005. (IROS 2005). 2005 IEEE/RSJ International Conference on

Print_ISBN

0-7803-8912-3

Type

conf

DOI

10.1109/IROS.2005.1544970

Filename

1544970