Title :
A novel manufacturing process for capacitors using offset lithography
Author :
Harrey, P.M. ; Evans, P.S.A. ; Ramsey, B.J. ; Harrison, D.
Author_Institution :
Dept. of Design, Brunel Univ., Egham, UK
Abstract :
A novel fabrication technique for passive electronic components and circuit interconnects based on offset lithographic printing is described. The application of this work is in low cost and low environmental impact substitutes for resin-laminate circuit boards populated with discrete components. Multilayer ceramic capacitor elements are formed on flexible substrates by depositing layers of metal and ceramic-loaded inks sequentially via a standard lithographic printing press
Keywords :
ceramic capacitors; lithography; printed circuit manufacture; thick film capacitors; ceramic-loaded inks deposition; circuit interconnects; conductive inks; dielectric inks; fabrication technique; flexible substrates; low cost; low environmental impact; manufacturing process; metal layers deposition; multilayer ceramic capacitor elements; offset lithographic printing; offset lithography; passive electronic components; printed capacitors; thick film capacitors; Capacitors; Ceramics; Costs; Electronic components; Fabrication; Flexible printed circuits; Integrated circuit interconnections; Manufacturing processes; Nonhomogeneous media; Printing;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On
Conference_Location :
Tokyo
Print_ISBN :
0-7695-0007-2
DOI :
10.1109/ECODIM.1999.747726
